Camera assembly, lens module, and electronic device

ABSTRACT

A camera assembly includes a photosensitive unit, including a photosensitive chip and an optical filter mounted on the photosensitive chip; functional components; and an encapsulation layer, embedded with the photosensitive unit and the functional components. The photosensitive chip and the functional components are exposed from a bottom surface of the encapsulation layer. A top surface of the encapsulation layer is higher than the photosensitive chip and functional components and exposes the optical filter. The photosensitive chip has soldering pads facing away from the bottom surface of the encapsulation layer. The functional components have soldering pads exposed from the bottom surface of the encapsulation layer. The camera assembly further includes a redistribution layer structure, disposed on the bottom surface of the encapsulation layer and electrically connecting to the soldering pads.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.16/235,267, filed on Dec. 28, 2018, which is a continuation applicationof PCT patent application No. PCT/CN2018/119986, filed on Dec. 10, 2018,which claims the priority of Chinese patent application Nos.CN201811385606.6, filed on Nov. 20, 2018, the entire contents of all ofwhich are incorporated herein by reference.

FIELD OF THE DISCLOSURE

The present disclosure generally relates to the field of lens moduletechnology and, more particularly, relates to a camera assembly, a lensmodule, and an electronic device.

BACKGROUND

As people's living standards continuously improve, people have more freetime to enjoy their leisure life. Photo-capturing has gradually become acommon means for people to record their outings and various aspects oftheir daily life. Thus, electronic devices (e.g., mobile phones, tabletsand cameras) with camera functions are widely used in people's dailylife and work and gradually become indispensable tools nowadays.

Electronic devices with camera functions are often configured with alens module. The design level of the lens modules plays an importantrole for determining quality of photographs taken by the electronicdevice. The lens module often includes a camera assembly having aphotosensitive chip and a lens assembly mounted on the camera assembly,used to capture images of photographed objects.

Moreover, to improve the imaging capability of the lens module, thephotosensitive chip may be required to have a large imaging areaaccordingly. Further, the lens module often includes passive componentssuch as resistors and capacitors, and peripheral circuit chips.

BRIEF SUMMARY OF THE DISCLOSURE

One aspect of the present disclosure provides a method for packaging acamera assembly. The method includes: providing a photosensitive chip;mounting an optical filter on the photosensitive chip; temporarilybonding the photosensitive chip and functional components on a carriersubstrate, where the photosensitive chip has soldering pads facing awayfrom the carrier substrate and the functional components have solderingpads facing toward the carrier substrate; forming an encapsulation layercovering the carrier substrate, the photosensitive chip, and thefunctional components, and exposing the optical filter; after theencapsulation layer is formed, removing the carrier substrate; and afterthe carrier substrate is removed, forming a redistribution layerstructure on a side of the encapsulation layer facing away from theoptical filter to electrically connect the soldering pads of thephotosensitive chip with the soldering pads of the functionalcomponents.

Another aspect of the present disclosure provides a camera assembly. Thecamera assembly includes: a photosensitive unit, including aphotosensitive chip and an optical filter mounted on the photosensitivechip; functional components; an encapsulation layer, embedded with thephotosensitive unit and the functional components, where thephotosensitive chip and the functional components are exposed from abottom surface of the encapsulation layer, a top surface of theencapsulation layer is higher than the photosensitive chip andfunctional components and exposes the optical filter, the photosensitivechip has soldering pads facing away from the bottom surface of theencapsulation layer, and the functional components have soldering padsexposed from the bottom surface of the encapsulation layer; and aredistribution layer structure, disposed on the bottom surface of theencapsulation layer and electrically connecting to the soldering pads.

Another aspect of the present disclosure provides a lens module. Thelens module includes: a camera assembly, which includes: aphotosensitive unit, including a photosensitive chip and an opticalfilter mounted on the photosensitive chip; functional components; anencapsulation layer, embedded with the photosensitive unit and thefunctional components, where the photosensitive chip and the functionalcomponents are exposed from a bottom surface of the encapsulation layer,a top surface of the encapsulation layer is higher than thephotosensitive chip and functional components and exposes the opticalfilter, the photosensitive chip has soldering pads facing away from thebottom surface of the encapsulation layer, and the functional componentshave soldering pads exposed from the bottom surface of the encapsulationlayer; and a redistribution layer structure, disposed on the bottomsurface of the encapsulation layer and electrically connecting to thesoldering pads; and a lens assembly, electrically connecting to thephotosensitive chip and the functional components and including a framemounted on the top surface of the encapsulation layer and surroundingthe photosensitive unit and the functional components.

Another aspect of the present disclosure provides an electronic device.The electronic device includes the disclosed lens module.

Other aspects of the present disclosure can be understood by thoseskilled in the art in light of the description, the claims, and thedrawings of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The following drawings are merely examples for illustrative purposesaccording to various disclosed embodiments and are not intended to limitthe scope of the present disclosure.

FIGS. 1-12 illustrate schematic cross-sectional views of structures atcertain stages of an exemplary method for packaging an exemplary cameraassembly according to an embodiment of the present disclosure;

FIG. 13 illustrates a schematic view of an exemplary lens moduleaccording to an embodiment of the present disclosure;

FIG. 14 illustrates a schematic view of an exemplary electronic deviceaccording to an embodiment of the present disclosure; and

FIG. 15 illustrates a flowchart of an exemplary method for packaging anexemplary camera assembly according to an embodiment of the presentdisclosure.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth toprovide a more thorough understanding of the disclosure. However, itwill be apparent to those skilled in the art that the present disclosuremay be implemented without one or more of these details. In otherinstances, some of the technical features well known in the art aredescribed herein to avoid confusion with the present disclosure.

It should be understood that the disclosed methods and structures can beimplemented in various forms and should not be construed as limited tothe embodiments set forth in the present disclosure. Instead, theseembodiments are provided so that the present disclosure will be thoroughand complete. In the accompanying drawings, the size and relativedimensions of the layers and regions may be enlarged for clarity. Thesame reference numbers indicate the same elements throughout the presentdisclosure.

It should be understood that when an element or layer is referred to as“on”, “adjacent to”, “connected to” or “coupled to” another element orlayer, it may be directly placed on the other element or layer, or maybe adjacent to, connected to, or coupled to the other element or layer.Alternatively, the element or layer may be indirectly placed on theother element or layer, or may be adjacent to, connected to, or coupledto the other element or layer as some intermediate elements and/orlayers are disposed between. In contrast, when an element is referred toas “directly on”, “directly adjacent to”, “directly connected to”, or“directly coupled to” another element or layer, no intermediate elementor layer is disposed between.

It should be understood that although the terms such as first, second,third, etc. are used to describe various components, regions, layers,and/or portions, these components, regions, layers, and/or portionsshould not be limited by the terms of first, second, third, etc. Theseterms are merely used to distinguish an element, component, region,layer, or portion. Therefore, a first element, component, region, layer,or portion discussed in the present disclosure may be alternativelyrepresented as a second element, component, region, layer, or portion.

Spatial relationship terms such as “under”, “below”, “the lower”,“underneath”, “above”, “the upper”, etc. are used here for illustrativepurposes. The terms may be used to describe the relationship of oneelement or feature shown in a figure with respect to other elements orfeatures. It should be understood that in addition to the orientationshown in the figures, the spatially relative terms are intended toencompass different orientations of the device in use and operation. Forexample, when a device in the figures is flipped, an element or featuredescribed as “under another element”, “under”, or “below” may beoriented “above” the other element or feature. Thus, the exemplary terms“below” and “under” may include both up and down directions. A devicemay be otherwise oriented (e.g. rotated 90 degrees or oriented to otherorientation), and the spatial descriptive terms used herein may beinterpreted accordingly.

The terms used herein are merely for the purpose of describing theparticular embodiments and are not intended to limit the scope of thepresent disclosure. When using the singular forms such as “a”, “one”,and “the/this”, these terms are also intended to include the pluralforms, unless otherwise specified in the context. It should also beunderstood that when the terms “composed of” and/or “comprising” areused in the specification, they are intended to describe the presence offeatures, integers, steps, operations, elements, and/or components, butnot to exclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groups. Whenused in the present disclosure, the term “and/or” includes any and allcombinations of the listed related items.

Various embodiments of the present disclosure are described herein withreference to schematic illustrations of cross-sectional views of thestructures (and intermediate structures) according to the preferredembodiments of the present disclosure. Thus, deviations from theillustrated shapes may be expected due to, e.g. manufacturing techniquesand/or tolerances. Therefore, the embodiments of the present disclosureshould not be limited to the specific shapes of the regions illustratedherein, but should include variations in the shapes due to, e.g.manufacturing. For example, an implanted region shown as a rectangle hasrounded or curved features and/or an implantation gradient at the edges,rather than has a binary change from the implanted region to thenon-implanted region. Similarly, a buried region formed by implantationcan result in some implantation in the region between the buried regionand the surface through which the implantation is performed. Therefore,the regions shown in the figures are illustrative and the shapes of theregions are not intended to represent the actual shapes of the regionsof the device, and thus, the shapes of the regions are not intended tolimit the scope of the present disclosure.

Currently, operational performance of lens module needs to be improvedand it is difficult to miniaturize and reduce thickness of the lensmodule.

An existing lens module primarily includes circuit boards, aphotosensitive chip, functional components (e.g., peripheral chips), anda lens assembly. The peripheral chips are often surface-mounted on aperipheral main board. The photosensitive chip is separated from thefunctional components. The circuit boards provide mechanical support forthe photosensitive chip, the functional components, and the lensassembly and electrical connections between the photosensitive chip, thefunctional components, and the lens assembly.

However, to satisfy the requirements for high pixel density andultra-thin thickness of the lens module, the lens module needs toprovide higher and higher imaging quality. Accordingly, photo-sensingarea of the photosensitive chip increases, and the number of thefunctional components increases. Thus, the dimension of the lens modulegrows too big to satisfy the requirements for miniaturization andultra-thin thickness of the lens module. Further, the photosensitivechip is disposed inside a support frame of the lens module while theperipheral chips are disposed outside the support frame of the lensmodule. Thus, the photosensitive chip and the peripheral chips areseparated by a certain distance, thereby reducing signal transmissionspeed. The peripheral chips include a digital signal processor (DSP)chip and a memory chip. It is likely that shooting speed and storingspeed may be negatively impacted, thereby degrading the operationalperformance of the lens module.

The present disclosure provides a camera assembly, a method forpackaging the camera assembly, a lens module, and an electronic device,for improving the operational performance of the lens module andreducing a total thickness of the lens module.

According to embodiments of the present disclosure, a photosensitivechip and functional components are integrated into an encapsulationlayer and are electrically connected with each other through aredistribution layer (RDL) structure. As a result, the physicaldistances between the photosensitive chip and the functional componentsdecrease, the electrical connections between the photosensitive chip andthe functional components are shortened, the signal transmission speedincreases, and the operational performance of the lens module improves.Further, the combination of an encapsulation layer and a redistributionlayer structure helps eliminate the circuit boards and reduces a totalthickness of the lens module, thereby satisfying the requirements forminiaturization and the ultra-thin thickness of the lens module.

In order to make the present disclosure easy to understand, detailedsteps and corresponding structures will be provided to explain thetechnical solutions of the present disclosure. In the following, variouspreferred embodiments of the present disclosure are described in detail.However, it should be noted that in addition to the embodimentsdescribed herein, the present disclosure may be implemented in otherforms.

FIG. 15 illustrates a flowchart of an exemplary method for packaging anexemplary camera assembly according to an embodiment of the presentdisclosure. FIGS. 1-12 illustrate schematic cross-sectional views ofstructures at certain stages of an exemplary method for packaging anexemplary camera assembly according to an embodiment of the presentdisclosure.

Referring to FIG. 1 and FIG. 2, FIG. 2 illustrates an enlarged view of aphotosensitive chip in FIG. 1. As shown in FIG. 2, the photosensitivechip 200 is provided (e.g., as shown in S10 of FIG. 15). Thephotosensitive chip 200 has soldering pads.

The photosensitive chip 200 may be an image sensor chip. In oneembodiment, the photosensitive chip 200 may be a CMOS image sensor (CIS)chip. In other embodiments, the photosensitive chip 200 may be a CCD(charge coupled device) image sensor chip.

In one embodiment, the photosensitive chip 200 may have optical signalreceiving surfaces 201. The photosensitive chip 200 may receive andsense optical irradiation signals through the optical signal receivingsurfaces 201. For example, the photosensitive chip 200 may include aphotosensitive region 200 a (as shown in FIG. 2) and a peripheral region200 b (as shown in FIG. 2) surrounding the photosensitive region 200 a.The optical signal receiving surfaces 201 may be disposed in thephotosensitive region 200 a.

The photosensitive chip 200 may include a plurality of pixel units.Thus, the photosensitive chip 200 may include a plurality ofsemiconductor photosensitive devices (not shown) and a plurality offiltering filter films (not shown) disposed on the plurality ofsemiconductor photosensitive devices. The plurality of filtering filmsmay be configured to selectively absorb and pass optical signalsreceived from the optical signal receiving surfaces 201. Thephotosensitive chip 200 may also include a plurality of micro-lenses 210disposed on the plurality of filtering films. Each of the plurality ofmicro-lenses 210 may one-to-one correspond to each of the plurality ofsemiconductor photosensitive devices. Thus, rays of the received opticalirradiated signals may be focused on the plurality of semiconductorphotosensitive devices, respectively. The optical signal receivingsurfaces 201 may correspond to top surfaces of the plurality ofmicro-lenses 210.

It should be noted that the photosensitive chip 200 may be asilicon-based chip and may be fabricated by an integrated circuitfabrication technology. The photosensitive chip 200 may have solderingpads configured for electrically connecting the photosensitive chip 200with other chips or components. In one embodiment, the photosensitivechip 200 may have first chip soldering pads 220 formed in the peripheralregion 200 b. The first chip soldering pads 220 may be exposed on asurface of the photosensitive chip 200 on the same side of the opticalsignal receiving surfaces 201.

Referring to FIG. 1 and FIG. 2 in conjunction with FIG. 3, FIG. 3illustrates an enlarged view of an optical filter 400 in FIG. 1. Theoptical filter 400 may be mounted on the photosensitive chip 200 (asshown in FIG. 1 and in S20 of FIG. 15).

After the optical filter 400 is mounted on the photosensitive chip 200,a photosensitive unit 250 may be formed. Mounting the optical filter 400on the photosensitive chip 200 may prevent subsequent packaging processfrom polluting the optical signal receiving surfaces 201 and may reducethe total thickness of a subsequently formed lens module. Thus, therequirements for miniaturization and ultra-thin thickness of the lensmodule may be satisfied.

The optical filter 400 may be an infrared filtering glass plate or afully transparent glass plate. In one embodiment, the optical filter 400may be the infrared filtering glass plate to eliminate an effect ofinfrared light in the incident light on performance of thephotosensitive chip 200, thereby improving imaging effectiveness.

For example, the optical filter 400 may be an infrared cut filter(IRCF). The infrared cut filter may be a blue glass infrared cut filteror a glass plate coated with an infrared cut coating. In one embodiment,the optical filter 400 may include a to-be-bonded surface 401. Theto-be-bonded surface 401 may be configured to provide a surface formounting on the photosensitive chip 200, that is, a surface facingtoward the photosensitive chip 200.

For example, when the optical filter 400 is the blue glass infrared cutfilter, a surface of the blue glass infrared cut filter may be coatedwith a transmittance enhancing film or an antireflection film, andanother surface opposite to the transmittance enhancing film or theantireflection film may be the to-be-bonded surface 401. When theoptical filter 400 is a glass plate coated with the infrared cutcoating, another surface opposite to the infrared cut coating may be theto-be-bonded surface 401. In other embodiments, when the optical filter400 is the fully transparent glass plate, any surface of the fullytransparent glass plate may be the to-be-bonded surface 401.

As shown in FIG. 3, the optical filter 400 may include a lighttransmittance region 400 a and a peripheral region 400 b surrounding thelight transmittance region 400 a. The light transmittance region 400 amay be configured to let external incident light pass through such thatthe optical signal receiving surfaces 201 of the photosensitive chip 200may receive optical signals, thereby ensuring the normal operationalfunction of the lens module. A space for mounting the optical filter 400on the photosensitive chip 200 may be reserved in the peripheral region400 b.

As shown in FIG. 1, in one embodiment, the optical filter 400 may bemounted on the photosensitive chip 200 by a bonding structure 410. Thebonding structure 410 may surround the optical signal receiving surfaces201.

The bonding structure 410 may be configured to physically connect theoptical filter 400 and the photosensitive chip 200 and to form a cavity(not labelled) enclosed by the optical filter 400, the bonding structure410, and the photosensitive chip 200 to prevent the optical filter 400from directly contacting the photosensitive chip 200, thereby avoidingthe performance degradation of the photosensitive chip 200 caused by theoptical filter 400.

In one embodiment, the bonding structure 410 may surround the opticalsignal receiving surfaces 201 to place the optical filter 400 disposedabove the optical signal receiving surfaces 201 in a photo-sensing pathof the photosensitive chip 200, thereby ensuring the optical performanceof the photosensitive chip 200.

For example, the bonding structure 410 may be made of a lithographicmaterial, and may be formed by a photolithography process, which notonly improves topography quality and dimensional accuracy of the bondingstructure 410, packaging efficiency, and production yield, but alsoreduces the degradation of bonding strength of the bonding structure410.

In one embodiment, the bonding structure 410 may be made of aphotolithographic dry film. In other embodiments, the bonding structure410 may be made of a photolithographic polyimide, a photolithographicpolybenzoxazole (PBO), or a photolithographic benzocyclobutene (BCB).

In one embodiment, to reduce complexity of the process of forming thebonding structure 410, simplify the process steps, and reduce theperformance degradation of the optical signal receiving surfaces 201caused by the fabrication process of the bonding structure 410, thebonding structure 410 may be formed on the optical filter 400.

For example, as shown in FIG. 1, the bonding step may include: providinga first carrier substrate 340; temporarily bonding a surface of theoptical filter 400 facing away from the to-be-bonded surface 401 to thefirst carrier substrate 340; after the temporary bonding is completed,forming a circular bonding structure 410 in the peripheral region 400 b(as shown in FIG. 3) of the optical filter 400; placing the opticalsignal receiving surfaces 201 of the photosensitive chip 200 in aposition facing toward the circular bonding structure 410; and mountingthe peripheral region 200 b (as shown in FIG. 2) of the photosensitivechip 200 on the circular bonding structure 410 to form thephotosensitive unit 250.

The first carrier substrate 340 may be configured to provide a platformfor subsequent bonding process, thereby improving process operability.In one embodiment, the first carrier substrate 340 may be a carrierwafer. In other embodiments, the first carrier substrate 340 may beother types of substrate.

For example, the optical filter 400 may be temporarily bonded on thefirst carrier substrate 340 by a first temporary bonding layer 345. Thefirst temporary bonding layer 345 may be configured to act as a peelinglayer to facilitate subsequent debonding.

In one embodiment, the first temporary bonding layer 345 may be a foamedfilm. The foamed film may include a micro-adhesive surface and a foamingsurface, facing opposite to each other. The foamed film may have aviscosity at a normal temperature. The foaming surface may be attachedto the first carrier substrate 340. The foamed film may be subsequentlyheated such that the foaming surface may lose the viscosity and thefoamed film may be detached. In other embodiments, the first temporarybonding layer 345 may also be a die attach film (DAF).

Referring to FIG. 4, it should be noted that, after the mounting step iscompleted, the packaging method may further include: attaching theoptical signal receiving surfaces 201 of the photosensitive chip 200 toan ultra-violet (UV) film 310; and after the attaching step iscompleted, performing a first debonding process to remove the firstcarrier substrate 340 (as shown in FIG. 1).

Through the attaching step, the photosensitive unit 250 may be preparedfor temporarily bonding on another carrier substrate in a subsequentstep. The UV film 310 may be configured to provide support and fixationfunction for the photosensitive unit 250 after the first carriersubstrate 340 is removed. After being irradiated by a UV light, theadhesion force of the UV film 310 may be weakened such that thephotosensitive unit 250 may be easily removed from the UV film 310.

For example, a film applicator may be used to tightly attach the UV film310 to a surface of the photosensitive chip 200 facing away from theoptical signal receiving surfaces 201 and to the bottom of a frame 315having a large diameter. The frame 315 may serve a function ofstretching the UV film 310, such that the photosensitive units 250 maybe separately fixed to the UV film 310. The detailed description of theUV film 310 and the frame 315 will not be repeated herein.

In one embodiment, the first temporary bonding layer 345 (as shown inFIG. 1) may be the foamed film. Thus, the first debonding process may bea thermal debonding process. For example, the first temporary bondinglayer 345 may be subject to a heat treatment for the foaming surface ofthe foamed film to lose the viscosity. As such, the first carriersubstrate 340 may be removed, and then, the first temporary bondinglayer 345 may be removed by tearing off.

Referring to FIG. 5, a second carrier substrate 320 may be provided. Thefunctional components (not labelled) and the photosensitive chip 200 maybe temporarily bonded on the second carrier substrate 320 (e.g., asshown in S30 of FIG. 15). The functional components may have solderingpads (not labelled). The soldering pads of the photosensitive chip 200may be disposed on a surface of the photosensitive chip 200 facing awayfrom the second carrier substrate 320. The soldering pads of thefunctional components may be disposed on a surface of the functionalcomponents facing toward the second carrier substrate 320.

Temporarily bonding the functional components and the photosensitivechip 200 on the second carrier substrate 320 may prepare for subsequentpackaging integration process and electrical connection integrationprocess of the functional components and the photosensitive chip 200.

Further, the method of temporary bonding (TB) may make it convenient tosubsequently separate the functional components and the photosensitivechip 200 from the second carrier substrate 320. The second carriersubstrate 320 may provide a platform for subsequent process of formingthe encapsulation layer.

In one embodiment, the second carrier substrate 320 may be a carrierwafer. In other embodiments, the second carrier substrate 320 may beother types of substrate.

For example, the functional components and the photosensitive chip 200may be temporarily bonded on the second carrier substrate 320 by asecond temporary bonding layer 325. In one embodiment, the secondtemporary bonding layer 325 may be a foamed foaming film. Thedescription of the second temporary bonding layer 325 may refer to therelevant description of the first temporary bonding layer 345 (as shownin FIG. 1) and will not be repeated herein.

In one embodiment, after the photosensitive chip 200 is temporarilybonded on the second carrier substrate 320, the first soldering pads 220of the photosensitive chip 200 may be disposed on a surface of thephotosensitive chip 200 facing away from the second carrier substrate320.

For example, an ultra-violet light may be irradiated on a position ofthe UV film 310 (as shown in FIG. 4) where a single photosensitive unit250 (as shown in FIG. 1) is located. The UV film 310 at the positionirradiated by the UV light may lose the viscosity. The correspondingphotosensitive unit 250 may be pushed up by a thimble and then may belifted by a suction device. The photosensitive units 250 may be peeledoff from the UV film 310 one by one and may be placed on the secondcarrier substrate 320 sequentially. The process of placing thephotosensitive units 250 one by one on the second carrier substrate 320may help improve positional accuracy of the photosensitive units 250 onthe second carrier substrate 320.

In one embodiment, only one photosensitive unit 250 may be illustrated.In other embodiments, when the formed lens module is applied to a dualcamera or array module product, a plurality of photosensitive units 250may be included.

It should be noted that, in one embodiment, after the optical filter 400is mounted on the photosensitive chip 200, the photosensitive chip 20may be temporarily bonded on the second carrier substrate 320. In otherembodiments, the optical filter may be mounted on the photosensitivechip after the photosensitive chip is temporarily bonded on the secondcarrier substrate.

The functional components may be components with specific functions inthe camera assembly other than the photosensitive chip 200. Thefunctional components may include at least one of peripheral chips 230or passive components 240. In one embodiment, the functional componentsmay include the peripheral chips 230 and the passive components 240.

The peripheral chips 230 may be active components. After the peripheralchips 230 are electrically connected to the photosensitive chip 200 in asubsequent step, the peripheral chips 230 may be configured to provideperipheral circuits for the photosensitive chip 200. For example, theperipheral chips 230 may include an analog power supply circuit, adigital power supply circuit, a voltage buffer circuit, a shuttercontrol circuit, a shutter driving circuit, etc.

In one embodiment, the peripheral chips 230 may include one or two ofdigital signal processing chip and memory chip. In other embodiments,the peripheral chips 230 may also include chips of other functionaltypes. For illustrative purposes, FIG. 5 only shows one peripheral chip230. However, the number of the peripheral chips 230 may be more thanone.

The peripheral chips 230 may be silicon-based chips and may befabricated by integrated circuit fabrication technologies. Theperipheral chips 230 may have soldering pads for electrically connectingto other chips and components. In one embodiment, the peripheral chips230 may have second chip soldering pads 235.

In one embodiment, to reduce complexity of subsequent electricalconnection process, the peripheral chips 230 may be temporarily bondedon the second carrier substrate 320. The second chip soldering pads 235of the peripheral chips 230 may be disposed on a surface of theperipheral chips 230 facing toward the second carrier substrate 320.

The passive components 240 may be configured to provide specificfunctions in the photo-sensing operation of the photosensitive chip 200.The passive components 240 may include resistors, capacitors, inductors,diodes, transistors, potentiometers, relays, drivers, and other smallsize electronic components. For illustrative purposes, FIG. 5 only showsone passive component 240. But the number of the passive components 240may be more than one.

The passive components 240 may also have soldering pads for electricallyconnecting to other chips and components. In one embodiment, thesoldering pads of the passive components 240 may be electrodes 245. Toreduce complexity of subsequent electrical connection process, thepassive components 240 may be temporarily bonded on the second carriersubstrate 320. The electrodes 245 of the passive components 240 may bedisposed on a surface of the passive components 240 facing toward thesecond carrier substrate 320.

It should be noted that making the soldering pads of the functionalcomponents face toward the second carrier substrate 320 may not onlyreduce complexity of subsequent process of forming the redistributionlayer structure 360, but also avoid controlling thickness differencesbetween the photosensitive chip 200 and the functional components. Thus,the packaging process may be simplified.

Referring to FIG. 6, the encapsulation layer 350 may be formed to coverthe second carrier substrate 320, the photosensitive chip 200 and thefunctional components (not labeled) while exposing the optical filter400 (e.g., as shown in S40 of FIG. 15).

The encapsulation layer 350 may play a role in holding thephotosensitive chip 200 and the functional components (e.g., peripheralchips 230, passive components 240) in place and achieving packagingintegration of the photosensitive chip 200 and the functionalcomponents.

The encapsulation layer 350 may not only help reduce a space occupied bythe frame of the lens assembly, but also eliminate circuit boards (e.g.,PCB). Thus, the total thickness of the subsequently formed lens modulemay be substantially reduced to satisfy the requirements forminiaturization and ultra-thin thickness of the lens module. Moreover,compared to the solution of mounting the functional components on theperipheral main board, integrating the photosensitive chip 200 and thefunctional components in the encapsulation layer 350 may reduce physicaldistances as well as electrical connection distances between thephotosensitive chip 200 and the functional components. Thus, the signaltransmission speed may be increased and the operational performance(e.g., improving shooting speed and storing speed) of the lens modulemay be improved.

The encapsulation layer may also play a role in insulation, sealing andmoisture-proof, and may improve the reliability of the lens module. Inone embodiment, the encapsulation layer 350 may be made of epoxy resin.Epoxy resin has the advantages of low shrinkage, good adhesion,corrosion resistant, superior electrical properties, and low cost. Epoxyresin is widely used in packaging electronic components and integratedcircuits.

In one embodiment, the encapsulation layer 350 may be formed by using aninjection molding process. The injection molding process has theadvantages of fast production speed, high efficiency, and automation ofoperation. Using the injection molding may increase the output andreduce the process cost.

For example, the step of forming the encapsulation layer 350 mayinclude: temporarily bonding the functional components (not labelled)and the photosensitive chip 200 on the second carrier substrate 320;after the optical filter 400 is mounted on the photosensitive chip 200,placing the second carrier substrate 320 in a mold having an upper partand a lower part; positioning the second carrier substrate 320 betweenthe upper part and the lower part of the mold; after the upper part andthe lower part are clamped together to close the mold, pressing the moldagainst the second carrier substrate 320 and the optical filter 400 andforming a cavity between the upper part and the lower part of the mold;injecting a molding material into the cavity to form the encapsulationlayer 350; and removing the mold.

In other embodiments, an encapsulation layer may be formed by usingother molding processes. For example, after the encapsulation layer isformed covering an optical filter, the encapsulation layer may be etchedor grinded to remove any portion of the encapsulation layer higher thanthe optical filter, thereby exposing the top surface of the opticalfilter in the remaining encapsulation layer. The top surface of theoptical filter may be a surface of the optical filter facing away fromthe photosensitive chip.

Because the encapsulation layer 350 covers the photosensitive chip 200and the functional components, any negative impact on the process offorming the encapsulation layer 350 due to thickness differences betweenthe photosensitive chip 200 and the functional components may beavoided. Accordingly, controlling the thickness differences between thephotosensitive chip 200 and the functional components may be avoided,thereby simplifying the process.

In one embodiment, the encapsulation layer 350 may also cover a sidewallof the optical filter 400 to improve the sealing performance of thecavity in the photosensitive unit 250 and to prevent water vapor andoxidizing gas from entering the cavity, thereby ensuring the performanceof the photosensitive chip 200. In addition, the optical filter 400 maybe prevented from protruding from the encapsulation layer 350, therebyfacilitating subsequent process of bonding the encapsulation layer 350on another carrier substrate.

It should be noted that, with the support of the encapsulation layer350, circuit boards may be eliminated. The effect of reducing the totalthickness of the lens module may have already been achieved. Thus, it isunnecessary to reduce the thickness of the photosensitive chip 200 orthe peripheral chips 230, thereby improving the mechanical strength andthe reliability of the photosensitive chip 200 and the peripheral chips230. In other embodiments, according to process requirements, thethickness of the photosensitive chip 200 and the peripheral chips 230may be appropriately reduced. However, the amount of thickness reductionmay not be substantial, thereby not compromising the mechanical strengthand the reliability.

It should be further noted that, in one embodiment, the encapsulationlayer 350 may be formed after the photosensitive chip 200 is bonded tothe second carrier substrate 320. Compared to the solution of forming anopening in the encapsulation layer 350 and placing the photosensitivechip 200 into the opening, the present disclosure may avoid the issue ofalignment error, thereby reducing complexity of the packaging process.

Continuing to refer to FIG. 5, in one embodiment, before theencapsulation layer 350 (as shown in FIG. 6) is formed, the packagingprocess may further include: forming a stress buffering layer 420covering the sidewall of the optical filter 400.

The stress buffering layer 420 may help reduce the stress caused by theencapsulation layer 350 on the optical filter 400 and may reduce theprobability of breaking the optical filter 400. Thus, the reliabilityand production yield of the packaging process may be improved, and thereliability of the lens module may be increased accordingly. Inparticular, the optical filter 400 may be the infrared filtering glassplate or the fully transparent glass plate. It is likely that the glassplate may break due to the stress. The stress buffering layer 420 maysubstantially reduce the probability of breaking the optical filter 400.

The stress buffering layer 420 may have a viscosity to ensure itsadhesion on the optical filter 400. In one embodiment, the stressbuffering layer 420 may be made of an epoxy-based glue. The epoxy-basedglue may be an epoxy resin adhesive. The epoxy-based glue may be invarious forms. By adjusting the composition, materials with differentelastic modulus may be obtained. Thus, the stress that the opticalfilter 400 is subject to may be controlled according to actualrequirements.

In one embodiment, after the photosensitive unit 250 (as shown inFIG. 1) is temporarily bonded on the second carrier substrate 320, thestress buffering layer 420 may be formed. Thus, the second carriersubstrate 320 may provide a platform for the process of forming thestress buffering layer 420.

For example, the stress buffering layer 420 may be formed by using adispensing process. By selecting the dispensing process, it is likely toimprove the compatibility between the step of forming the stressbuffering layer 420 and the current packaging process, therebysimplifying the process.

In one embodiment, the stress buffering layer 420 may also cover asidewall of the bonding structure 410 to reduce the stress caused by theencapsulation layer 350 on the bonding structure 410, thereby furtherimproving the reliability and production yield of the packaging process.

In other embodiments, a stress buffering layer may be formed before anoptical filter is mounted on a photosensitive chip. Alternatively, thestress buffering layer may be formed after the optical filter is mountedon the photosensitive chip and before photosensitive unit is temporarilybonded on the second carrier substrate.

Referring to FIG. 7, after the encapsulation layer 350 is formed, asecond debonding process may be performed to remove the second carriersubstrate 320 (as shown in FIG. 6 and in S50 of FIG. 15).

The removal of the second carrier substrate 320 may expose the solderingpads of the functional components, thereby preparing for subsequentprocess of forming the redistribution layer structure 360. In oneembodiment, the step of the second debonding process may include:sequentially removing the second carrier substrate 320 and the secondtemporary bonding layer 325 (as shown in FIG. 6). The description of thesecond debonding process may refer to the relevant description of thefirst debonding process and will not be repeated herein.

It should be noted that, after the encapsulation layer 350 is formed andbefore the second debonding process is performed, the packaging processmay further include: temporarily bonding a surface of the encapsulationlayer 350 facing away from the second carrier substrate 320 on a thirdcarrier substrate 330.

The third carrier substrate 330 may be configured to provide a platformfor subsequent process of forming the redistribution layer structure360. In one embodiment, the third carrier substrate 330 may be a carrierwafer. In other embodiments, the third carrier substrate 330 may beother types of substrate.

For example, the encapsulation layer 350 may be temporarily bonded onthe third carrier substrate 330 by a third temporary bonding layer 335.The detailed description of the third temporary bonding layer 335 mayrefer to the relevant description of the first temporary bonding layer345 (as shown in FIG. 1) and will not be repeated herein.

Referring to FIGS. 8-10, after the second carrier substrate 320 isremoved, the redistribution layer structure 360 (as shown in FIG. 10)may be formed on a side of the encapsulation layer 350 facing away fromthe optical filter 400 to electrically connect the soldering pads of thephotosensitive chip 200 and the soldering pads of the functionalcomponents (e.g., as shown in S60 of FIG. 15).

The redistribution layer structure 360 may be configured to achieve theelectrical connection integration of forming the camera assembly.

In one embodiment, the encapsulation layer 350 and the redistributionlayer structure 360 may be configured to reduce the physical distancesbetween the photosensitive chip 200 and the functional components aswell as the electrical connection distances between the photosensitivechip 200 and the functional components. Thus, the signal transmissionspeed may be increased, and the operational performance of the lensmodule may be improved. For example, the peripheral chips 230 mayinclude one or two of the digital signal processing chip and the memorychip. Correspondingly, the shooting speed and the storing speed may beincreased.

Further, by selecting the redistribution layer structure 360, it islikely to reduce the distances between the photosensitive chip 200 andthe functional components while improving the feasibility of theelectrical connection process. Compared to a wire bonding process, theredistribution layer structure 360 may facilitate batch processing andimprove the packaging efficiency. In addition, because theredistribution layer structure 360 is formed on the side of theencapsulation layer 350 facing away from the optical filter 400, theprocess of forming the redistribution layer structure 360 may havelittle impact on the optical filter 400.

In one embodiment, the redistribution layer structure 360 mayelectrically connect the first chip soldering pads 220, the second chipsoldering pads 235, and the electrodes 245.

For example, the step of forming the redistribution layer structure 360may include: referring to FIG. 8, forming conductive posts 280 in thephotosensitive chip 200, where the conductive posts 280 electricallyconnect to the corresponding soldering pads of the photosensitive chip200.

The conductive posts 280 may electrically connect to the correspondingfirst chip soldering pads 220 of the photosensitive chip 200. Theconductive posts 280 may be configured to be external electrodes of thephotosensitive chip 200 to subsequently facilitate the electricalconnections between the photosensitive chip 200 and the functionalcomponents through the conductive posts 280.

The conductive posts 280 may be electrically connected to metalinterconnection structures in the photosensitive chip 200 or may passthrough the photosensitive chip 200 to directly electrically connect tothe corresponding first chip soldering pads 220.

The top surface of the conductive posts 280 may be exposed on theencapsulation layer 350. Through the conductive posts 280, the externalelectrodes of the photosensitive chip 200 and the soldering pads of thefunctional components may be disposed on a same side of theencapsulation layer 350, thereby facilitating subsequent process offorming the redistribution layer structure 360. The top surface of theconductive posts 280 may refer to: a surface of the conductive posts 280facing away from the optical filter 400 along an extension direction ofthe conductive posts 280.

In one embodiment, the conductive posts 280 may be made of copper toimprove conductive performance of the conductive posts 280 and to reducecomplexity of the process of forming the conductive posts 280. In otherembodiments, the conductive posts 280 may be made of other suitableconductive materials such as tungsten.

For example, the conductive posts 280 may be formed by a through-siliconvia (TSV) process.

Referring to FIG. 9, after the conductive posts 280 are formed, adielectric layer 332 may be formed on a side of the encapsulation layer350 facing away from the optical filter 400. The dielectric layer 332may cover the encapsulation layer 350, the photosensitive chip 200, thefunctional components (not labelled), and the conductive posts 280.Interconnection trenches 338 may be formed in the dielectric layer 332by a graphic patterning process. The interconnection trenches 338 mayexpose the soldering pads of the functional components and theconductive posts 280.

The interconnection trenches 338 in the dielectric layer 332 may beconfigured to define shapes, positions and dimensions of subsequentinterconnections. In one embodiment, the dielectric layer 332 may bemade of photosensitive material. Accordingly, the interconnectiontrenches 338 may be formed by a photolithography process, therebysimplifying complexity of the process of forming the interconnectiontrenches 338.

For example, the dielectric layer 332 may be made of photosensitivepolyimide, photosensitive benzocyclobutene, or photosensitivepolybenzoxazole.

Referring to FIG. 10, interconnect lines 361 may be formed in theinterconnection trenches 338 (as shown in FIG. 9). The dielectric layer332 (as shown in FIG. 9) may be removed.

The interconnect lines 361 and the conductive posts 280 together mayform the redistribution layer structure 360.

In one embodiment, the interconnect lines 361 may be formed in theinterconnection trenches 338 by an electroplating process.

In one embodiment, the interconnect lines 361 may be made of copper.Copper has substantially low resistivity, which is beneficial to improveelectrical connection reliability and electrical conductivity of theinterconnect lines 361. Further, copper has superior filling property,which is beneficial to simplify complexity of the process of forming theinterconnect lines 361 and to improve the formation quality. In otherembodiments, the interconnect lines 361 may be made of other suitableconductive materials such as tungsten.

After the interconnect lines 361 are formed, the dielectric layer 332may be removed, thereby preparing for subsequent process. In oneembodiment, the dielectric layer 332 may be made of corrosion resistantmaterial. Thus, after the interconnect lines 361 are formed, thedielectric layer 332 may be removed by a reactive ion etching process.

In one embodiment, the encapsulation layer 350 may be configured toprovide a platform for the process of forming the redistribution layerstructure 360. Accordingly, complexity of the process of forming theredistribution layer structure 360 may be reduced.

In other embodiments, the interconnect lines 361 may be formed by adirect etching process. For example, the step of forming theredistribution layer structure may include: forming the conductive postsin the photosensitive chip to electrically connect to the correspondingsoldering pads of the photosensitive chip; forming a conductive layer ona surface of the encapsulation layer facing away from the optical filterto cover the encapsulation layer, the photosensitive chip, thefunctional components, and the conductive posts; performing an etchingprocess on the conductive layer to form the interconnect lines, wherethe interconnect lines cover the conductive posts and the soldering padsof the functional components, and the interconnect lines and theconductive posts form the redistribution layer structure.

In one embodiment, the interconnect lines may be made of conductivematerials such as aluminum, which is easily patterned by an etchingprocess.

Referring to FIG. 11, after the redistribution layer structure 360 isformed, a third debonding process may be performed to remove the thirdcarrier substrate 330 (as shown in FIG. 10).

The removal of the third carrier substrate 330 may provide a processfoundation for subsequently assembling the lens assembly.

In one embodiment, the step of the third debonding process may include:sequentially removing the third carrier substrate 330 and the thirdtemporary bonding layer 335 (as shown in FIG. 10). The detaileddescription of the third debonding process may refer to the relevantdescription of the first debonding process and will not be repeatedherein.

Referring to FIG. 12, after the third carrier substrate 330 (as shown inFIG. 10) is removed, the packaging process may further include:performing a dicing process on the encapsulation layer 350.

Through the dicing process, individual camera assembly 260 satisfyingthe dimension requirement may be formed, thereby preparing forsubsequent process of assembling the lens assembly. In one embodiment,the dicing process may be a laser cutting process.

It should be noted that, in one embodiment, the third debonding processmay be performed before the dicing process is performed. In otherembodiments, the third debonding process may be performed after thedicing process is performed. Correspondingly, the third carriersubstrate 330 may provide a platform for the dicing process.

Continuing to refer to FIG. 12, after the redistribution layer structure360 is formed, the packaging process may further include: bonding aflexible printed circuit (FPC) board 510 on the redistribution layerstructure 360.

Under the circumstance that circuit boards are eliminated, the FPC board510 may provide electrical connections between the camera assembly 260and the subsequent lens assembly and between the formed lens module andother components. After the lens module is subsequently formed, the lensmodule may also be electrically connected to other components in anelectronic device through the FPC board 510, thereby realizing a normalshooting function of the electronic device.

In one embodiment, the FPC board 510 may include electronic circuits.The FPC board 510 may be bonded on the redistribution layer structure360 by a metal bonding process, thereby achieving the electricalconnections. For example, the FPC board 510 may be bonded on theinterconnect lines 361.

In one embodiment, to improve the process feasibility, after the thirddebonding process and the dicing process are performed, the FPC board510 may be bonded on the redistribution layer structure 360.

It should be noted that a connector 520 may be mounted on the FPC board510 to electrically connect the FPC board 510 to other circuitcomponents. When the lens module is used in an electronic device, theconnector 520 may be electrically connected to a main board of theelectronic device, thereby facilitating information transmission betweenthe lens module and other components in the electronic device. Forexample, image information may be transferred from the lens module tothe electronic device. For example, the connector 520 may be a goldfinger connector.

Correspondingly, the present disclosure also provides a camera assembly.Continuing to refer to FIG. 12, a structural diagram of an exemplarycamera assembly according to the embodiments of the present disclosureis shown.

The camera assembly 260 may include: the encapsulation layer 350, thephotosensitive unit 250 (as shown in FIG. 1) and the functionalcomponents (not labelled) that are embedded in the encapsulation layer350. The photosensitive unit 250 may include the photosensitive chip 200and the optical filter 400 mounted on the photosensitive chip 200. Thebottom surface of the encapsulation layer 350 may expose thephotosensitive chip 200 and the functional components. The top surfaceof the encapsulation layer 350 may be higher than the photosensitivechip 200 and the functional components and may expose the optical filter400.

Both the photosensitive chip 200 and the functional components may havesoldering pads (not labelled). The soldering pads of the photosensitivechip 200 may face away from the bottom surface of the encapsulationlayer 350. The soldering pads of the functional components may exposefrom the bottom surface of the encapsulation layer 350. Theredistribution layer structure 360 may be disposed on the bottom surfaceof the encapsulation layer 350. The redistribution layer structure 360may be electrically connected to the soldering pads.

The encapsulation layer 350 may play a role in holding thephotosensitive chip 200 and the functional components in place, therebyachieving the packaging integration of the photosensitive chip 200 andthe functional components. The encapsulation layer 350 may not onlyreduce the space occupied by the frame of the lens assembly, but alsoeliminate the circuit boards. Thus, the total thickness of thesubsequently formed lens module may be substantially reduced to satisfythe requirements for miniaturization and ultra-thin thickness of thelens module.

The encapsulation layer 350 may be made of plastic encapsulationmaterial. The encapsulation layer 350 may also play a role ininsulation, sealing and moisture-proof, and may improve the reliabilityof the lens module. In one embodiment, the encapsulation layer 350 maybe made of epoxy resin.

In one embodiment, the encapsulation layer 350 may include a top surfaceand a bottom surface facing opposite to each other. The top surface ofthe encapsulation layer 350 may be configured to mount the lensassembly.

In one embodiment, in the process of packaging the camera assembly 260,after the photosensitive chip 200 and the functional components aretemporarily bonded on the carrier substrate, the encapsulation layer 350may be formed on the carrier substrate. Thus, the bottom surface of theencapsulation layer 350 may expose the photosensitive chip 200 and thefunctional components.

In one embodiment, the top surface of the encapsulation layer 350 may behigher than the photosensitive chip 200 and the functional components.The encapsulation layer 350 may also cover the sidewall of the opticalfilter 400 to improve the sealing performance of the cavity in thephotosensitive unit 250 and to prevent water vapor and oxidizing gasfrom entering the cavity, thereby ensuring the performance of thephotosensitive chip 200.

In one embodiment, the photosensitive chip 200 may be a CMOS imagesensor chip. In other embodiments, the photosensitive chip 200 may be aCCD image sensor chip. The photosensitive chip 200 may include thephotosensitive region 200 a (as shown in FIG. 2) and the peripheralregion 200 b (as shown in FIG. 2) surrounding the photosensitive region200 a. The photosensitive chip 200 may also have the optical signalreceiving surfaces 201 located in the photosensitive region 200 a.

The photosensitive chip 200 may be a silicon-based chip. The solderingpads of the photosensitive chip 200 may be configured to electricallyconnect the photosensitive chip 200 to other chips or components. In oneembodiment, the photosensitive chip 200 may have the first chipsoldering pads 220 located in the peripheral region 200 b. The firstchip soldering pads 220 may face toward the optical filter 400. That is,the first chip soldering pads 220 may face away from the bottom surfaceof the encapsulation layer 350.

The optical filter 400 may be mounted on the photosensitive chip 200 toprevent the packaging process from polluting the optical signalreceiving surfaces 201 and to reduce the total thickness of the lensmodule.

To support the normal operation of the lens module, the optical filter400 may be an infrared filtering glass plate or a fully transparentglass plate. In one embodiment, the optical filter 400 may be theinfrared filtering glass plate to eliminate an effect of infrared lightin the incident light on performance of the photosensitive chip 200,thereby improving imaging effectiveness.

In one embodiment, the optical filter 400 may be mounted on thephotosensitive chip 200 through the bonding structure 410. The bondingstructure 410 may surround the optical signal receiving surfaces 201 ofthe photosensitive chip 200. The bonding structure 410 may be configuredto physically connect the optical filter 400 and the photosensitive chip200 and to form a cavity (not labelled) enclosed by the optical filter400, the bonding structure 410, and the photosensitive chip 200 toprevent the optical filter 400 from directly contacting thephotosensitive chip 200, thereby avoiding the performance degradation ofthe photosensitive chip 200 caused by the optical filter 400.

In one embodiment, the bonding structure 410 may be made of aphotolithographic dry film. In other embodiments, the bonding structure410 may be made of a photolithographic polyimide, a photolithographicpolybenzoxazole (PBO), or a photolithographic benzocyclobutene (BCB).

In one embodiment, the bonding structure 410 may surround the opticalsignal receiving surfaces 201 to place the optical filter 400 disposedabove the optical signal receiving surfaces 201 in a photo-sensing pathof the photosensitive chip 200, thereby ensuring the optical performanceof the photosensitive chip 200.

In one embodiment, only one photosensitive unit 250 may be illustrated.In other embodiments, when the formed lens module is applied to a dualcamera or array module product, a plurality of photosensitive units 250may be included.

It should be noted that because the encapsulation layer 350 covers thesidewall of the optical filter 400, the camera assembly 260 may alsoinclude: the stress buffering layer 420 disposed between theencapsulation layer 350 and the sidewall of the optical filter 400.

The stress buffering layer 420 may help reduce the stress caused by theencapsulation layer 350 on the optical filter 400 to reduce theprobability of breaking the optical filter 400. Thus, the reliability ofthe lens module may be improved. In one embodiment, the stress bufferinglayer 420 may be made of epoxy-based glue.

In one embodiment, the stress buffering layer 420 may be disposedbetween the encapsulation layer 350 and the sidewall of the bondingstructure 410, thereby reducing the stress caused by the encapsulationlayer 350 on the bonding structure 410 and improving the reliability andproduction yield of the camera assembly 260.

The functional components may be components with specific functions inthe camera assembly other than the photosensitive chip 200. Thefunctional components may include at least one of peripheral chips 230or passive components 240. In one embodiment, the soldering pads of thefunctional components may be exposed from the bottom surface of theencapsulation layer 350, thereby reducing complexity of the process offorming the redistribution layer structure 360.

In one embodiment, the functional components may include the peripheralchips 230 and the passive components 240. The peripheral chips 230 maybe active components and may be configured to provide peripheralcircuits for the photosensitive chip 200. For example, the peripheralchips 230 may include an analog power supply circuit, a digital powersupply circuit, a voltage buffer circuit, a shutter control circuit, anda shutter driving circuit, etc.

In one embodiment, the peripheral chips 230 may include one or two ofdigital signal processing chip and memory chip. In other embodiments,the peripheral chips 230 may also include chips of other functionaltypes. For illustrative purposes, FIG. 12 only shows one peripheral chip230. But the number of the peripheral chips 230 may be more than one.

The peripheral chips 230 may be silicon-based chips. The peripheralchips 230 may have soldering pads for electrically connecting to otherchips and components. In one embodiment, the peripheral chips 230 mayhave the second chip soldering pads 235. The second chip soldering pads235 may be exposed from the bottom surface of the encapsulation layer350.

The passive components 240 may be configured to provide specificfunctions in the photo-sensing operation of the photosensitive chip 200.The passive components 240 may include resistors, capacitors, inductors,diodes, transistors, potentiometers, relays, drivers, and other smallsize electronic components. For illustrative purposes, FIG. 12 onlyshows one passive component 240. But the number of the passivecomponents 240 may be more than one.

The passive components 240 may also have soldering pads for electricallyconnecting to other chips and components. In one embodiment, thesoldering pads of the passive components 240 may be electrodes 245. Theelectrodes 245 may be exposed from the bottom surface of theencapsulation layer 350.

The redistribution layer structure 360 may be configured to electricallyintegrate the camera assembly 260. The operational performance (e.g.,improving shooting speed and storing speed) of the lens module may beimproved by the redistribution layer structure 360 and the encapsulationlayer 350. Moreover, the feasibility of the electrical connectionprocess and the packaging efficiency may be improved by theredistribution layer structure 360.

In one embodiment, the redistribution layer structure 360 mayelectrically connect the first chip soldering pads 220, the second chipsoldering pads 235, and the electrodes 245.

Because the soldering pads of the functional components are exposed fromthe bottom surface of the encapsulation layer 350 and the soldering padsof the photosensitive chip 200 face away from the bottom surface of theencapsulation layer 350, the redistribution layer structure 360 mayinclude: the conductive posts 280 disposed in the photosensitive chip200 and electrically connected to the soldering pads of thephotosensitive chip 200, and the interconnect lines 361 disposed on thesoldering pads of the functional components and the conductive posts 280and electrically connected to the soldering pads of the functionalcomponents and the conductive posts 280.

The conductive posts 280 may electrically connect to the correspondingfirst chip soldering pads 220 of the photosensitive chip 200. Theconductive posts 280 may be configured to be external electrodes of thephotosensitive chip 200.

The conductive posts 280 may be exposed from the bottom surface of theencapsulation layer 350. As such, the external electrodes of thephotosensitive chip 200, the second chip soldering pads 235, and theelectrodes 245 may be disposed on a same side of the encapsulation layer350, thereby facilitating the electrical connections between thephotosensitive chip 200, the peripheral chips 230, and the passivecomponents 240. The conductive posts 280 may be electrically connectedto metal interconnection structures in the photosensitive chip 200 ormay pass through the photosensitive chip 200 to directly electricallyconnect to the corresponding first chip soldering pads 220.

In one embodiment, the conductive posts 280 may be made of copper toimprove the conductive performance of the conductive posts 280 and toreduce complexity of the process of forming the conductive posts 280. Inother embodiments, the conductive posts 280 may be made of othersuitable conductive materials such as aluminum.

In one embodiment, because the conductive posts 280 and the solderingpads of the functional components are exposed from the bottom surface ofthe encapsulation layer 350, complexity of the process of forming theinterconnect lines 361 may be reduced accordingly.

In one embodiment, the interconnect lines 361 may be made of copper.Copper has substantially low resistivity, which is beneficial to improveelectrical connection reliability and electrical conductivity of theredistribution layer structure 360. In other embodiments, theinterconnect lines 361 may be made of other suitable conductivematerials such as tungsten.

In one embodiment, the camera assembly 260 may further include: the FPCboard 510 disposed on the redistribution layer structure 360. Under thecircumstance that circuit boards are eliminated, the FPC board 510 mayprovide electrical connections between the camera assembly 260 and thelens assembly and between the lens module and other components. The lensmodule may also be electrically connected to other components in theelectronic device through the FPC board 510, thereby realizing a normalshooting function of the electronic device. For example, the FPC board510 may be bonded on the interconnect lines 361. The FPC board 510 mayinclude electronic circuits, thereby achieving the electricalconnections between the FPC board 510 and the redistribution layerstructure 360.

It should be noted that the connector 520 may be mounted on the FPCboard 510. When the lens module is used in the electronic device, theconnector 520 may be electrically connected to the main board of theelectronic device, thereby facilitating information transmission betweenthe lens module and other components in the electronic device. Forexample, image information may be transferred from the lens module tothe electronic device. For example, the connector 520 may be a goldfinger connector.

In the present disclosure, the camera assembly may be formed by usingthe packaging method described in the foregoing embodiments or may beformed by using other packaging methods. The detailed description of thecamera assembly may refer to the relevant description in the foregoingembodiments and will not be repeated herein.

Correspondingly, the present disclosure also provides a lens module.FIG. 13 illustrates a schematic view of an exemplary lens moduleaccording to an embodiment of the present disclosure.

The lens module 600 may include: the camera assembly (as shown in thedashed box in FIG. 13) according to embodiments of the presentdisclosure and a lens assembly 530 including a frame 535. The frame 535may be mounted on the top surface of the encapsulation layer (notlabelled) and may surround the photosensitive unit (not labelled) andthe functional components (not labelled). The lens assembly 530 may beelectrically connected to the photosensitive chip (not labelled) and thefunctional components.

The lens assembly 530 may include the frame 535, a motor (not shown)mounted on the frame 535, and a lens group (not labelled) mounted on themotor. The frame 535 may facilitate assembling the lens assembly 530 andmay place the lens group in the photo-sensing path of the photosensitiveunit.

In one embodiment, the camera assembly may have a thin thickness. Thethickness of the lens assembly 530 may be reduced by the encapsulationlayer, thereby reducing the total thickness of the lens module 600.Moreover, the photosensitive unit and the functional components may bedisposed inside the frame 535. Compared to the solution of mounting thefunctional components (e.g., peripheral chips) on the peripheral mainboard, the present disclosure may reduce distances between thephotosensitive unit and the functional components, correspondinglyreduce the dimension of the lens module 600, shorten electricalconnection distances, substantially increase signal transmission speedof the lens module 600, and improve the operational performance (e.g.,improving the shooting speed and the storing speed) of the lens module600. Further, the method of integrating the photosensitive unit and thefunctional components in the encapsulation layer and disposing thephotosensitive unit and the functional components inside the frame 535may protect the photosensitive unit and the functional components. Thus,the reliability and stability of the lens module 600 may be improved,and the imaging quality of the lens module 600 may be ensured.

In one embodiment, an FPC board (not labelled) may be bonded on aredistribution layer structure (not labelled). The motor in the lensassembly 530 may be electrically connected to various chips andcomponents in the camera assembly through the FPC board.

It should be noted that the detailed description of the camera assemblymay refer to the relevant description in the foregoing embodiments andwill not be repeated herein.

Correspondingly, the present disclosure also provides an electronicdevice. FIG. 14 illustrates a schematic view of an exemplary electronicdevice according to an embodiment of the present disclosure.

In one embodiment, the electronic device 700 may include the lens module600 according to embodiments of the present disclosure.

The high reliability and superior operational performance of the lensmodule 600 may correspondingly improve the shooting quality, theshooting speed, and the storing speed of the electronic device 700.Moreover, the ultra-thin total thickness of the lens module 600 mayimprove user experience.

For example, the electronic device may be a mobile phone, a tabletcomputer, a camera, a camcorder, or other devices having a camerafunction.

As disclosed, the technical solutions of the present disclosure have thefollowing advantages.

In the embodiments of the present disclosure, the photosensitive chipand the functional components may be integrated in the encapsulationlayer and may be electrically connected through the redistribution layerstructure. Compared to surface-mounting the functional components on theperipheral main board, the embodiments of the present disclosure mayeffectively reduce physical distances between the photosensitive chipand the functional components, correspondingly shorten electricalconnection distances between the photosensitive chip and the functionalcomponents, and consequently improve the signal transmission speed.

Thus, the operational performance (e.g., improving the image shootingspeed and image storing speed) of the lens module may be improved.Further, the encapsulation layer and the redistribution layer structuremay be configured to eliminate circuit boards (e.g., PCBs) and to reducethe total thickness of the lens module, thereby satisfying therequirements for miniaturization and ultra-thin thickness of the lensmodule.

The details of the present disclosure have been described through theembodiments provided above. However, it should be understood that theabove embodiments are only for the purpose of illustration anddescription. Further, those skilled in the art can understand that thepresent disclosure is not limited to the above embodiments, and variousmodifications and changes can be made according to the principles of thepresent disclosure.

These modifications and modifications are all in the scope of thepresent disclosure. The scope of the present disclosure is defined bythe appended claims and their equivalents.

What is claimed is:
 1. A camera assembly, comprising: a photosensitiveunit, including a photosensitive chip and an optical filter mounted onthe photosensitive chip; functional components; an encapsulation layer,embedded with the photosensitive unit and the functional components,wherein: the photosensitive chip and the functional components areexposed from a bottom surface of the encapsulation layer, a top surfaceof the encapsulation layer is higher than the photosensitive chip andfunctional components and exposes the optical filter, the photosensitivechip has soldering pads facing away from the bottom surface of theencapsulation layer, and the functional components have soldering padsexposed from the bottom surface of the encapsulation layer; and aredistribution layer structure, disposed on the bottom surface of theencapsulation layer and electrically connecting to the soldering pads.2. The camera assembly according to claim 1, wherein the redistributionlayer structure includes: conductive posts disposed in thephotosensitive chip and electrically connected to the soldering pads ofthe photosensitive chip; and interconnect lines disposed on thesoldering pads of the functional components and the conductive posts andelectrically connected to the soldering pads of the functionalcomponents and the conductive posts.
 3. The camera assembly according toclaim 1, wherein: the encapsulation layer also covers a sidewall of theoptical filter.
 4. The camera assembly according to claim 3, furtherincluding: a stress buffering layer disposed between the sidewall of theoptical filter and the encapsulation layer.
 5. The camera assemblyaccording to claim 1, wherein: the functional components include atleast one of peripheral chips or passive components; and the peripheralchips include one or two of digital signal processing chip and memorychip.
 6. The camera assembly according to claim 1, further including: aflexible printed circuit (FPC) board disposed on the redistributionlayer structure.
 7. A lens module, comprising: a camera assembly, whichincludes: a photosensitive unit, including a photosensitive chip and anoptical filter mounted on the photosensitive chip; functionalcomponents; an encapsulation layer, embedded with the photosensitiveunit and the functional components, wherein: the photosensitive chip andthe functional components are exposed from a bottom surface of theencapsulation layer, a top surface of the encapsulation layer is higherthan the photosensitive chip and functional components and exposes theoptical filter, the photosensitive chip has soldering pads facing awayfrom the bottom surface of the encapsulation layer, and the functionalcomponents have soldering pads exposed from the bottom surface of theencapsulation layer; and a redistribution layer structure, disposed onthe bottom surface of the encapsulation layer and electricallyconnecting to the soldering pads; and a lens assembly, electricallyconnecting to the photosensitive chip and the functional components andincluding a frame mounted on the top surface of the encapsulation layerand surrounding the photosensitive unit and the functional components.8. An electronic device, comprising the lens module according to claim7.